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TSMC's Entire CoWoS Supply Reportedly Reserved By NVIDIA & AMD Until 2025

TSMC's Entire CoWoS Supply Reportedly Reserved By NVIDIA & AMD Until 2025

AMD and NVIDIA have reportedly secured TSMC's entire CoWoS production for the next two years as the two firms compete aggressively in the AI ​​race.

TSMC expects to dramatically increase CoWoS output, working alongside the entire supply secured by NVIDIA and AMD, as well as the next-gen SoIC standard.

Well, it's no secret that the AI ​​industry is in desperate need of computing power, and to facilitate the process, manufacturers like NVIDIA and AMD have given their all to ensure that They invest fully in the markets. In light of this, suppliers such as TSMC continue to have a gold rush, not only because they are facing high demand but also because their existing facilities have been massively outgrown, particularly CoWoS. and regarding packaging processes including the new SoIC standard.

Taiwan Economic Daily reports that TSMC has seen its packaging supply fully booked by AMD and NVIDIA. CoWoS technology is being used for the development of NVIDIA's Hopper and the latest Blackwell GPUs While AMD is also leveraging this for its MI300 accelerator..

The Taiwanese semiconductor giant plans to massively scale its production facilities in response to such high demand. The company aims to achieve production of around 45,000 to 55,000 units by the end of this year, marking a broad annual growth. This not only shows how much demand the industry is seeing, but also that TSMC has shown flexibility and gone to great lengths to meet customer demand.

In addition to CoWoS, TSMC plans to upscale the SoIC, which is slated to reach around 5,000 to 6,000. For those unaware, SoIC (System on Integrated Chip) is the next iteration of CoWoS, which comes with high density stacking capabilities and extremely high bandwidth. Because of these features, the standard has been widely adopted in modern times, especially in HPC applications. While NVIDIA has yet to integrate the SoIC into modern-day AI architectures, AMD has already implemented the SoIC with its core Instinct MI300 AI accelerator.

With expected future demand, TSMC's SoIC production will reach 10,000 units by 2025. This will mark the transition to future standards for chip packaging, and once again create new opportunities for TSMC and others involved. We Recently gave a rundown What TSMC expects with the future of packaging markets, and with it, the SoIC is going to play an important role.

News Source: Taiwan Economic Daily

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