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TSMC Ready For The Angstrom-14 Era, Initiates Development On Cutting-Edge 1.4nm Process

TSMC Ready For The Angstrom-14 Era, Initiates Development On Cutting-Edge 1.4nm Process

TSMC has announced that the firm has finally entered the “Angstrom 14 Era” as it begins development on its innovative A14 process.

TSMC doesn't seem far behind the competition, with 1.4nm “angstrom” nodes dropping in the next five years.

TSMC released its annual report 2023 a few months ago., but apparently, there was important information in the documents that was missed. Before we dive into that, let's talk a little about TSMC's A14, or as many analysts out there have dubbed it, the tech revolution.

Right now, we're on the timeline for TSMC's 3nm processes to begin mass adoption. So, 1.4 nm still has a long way to go before it hits the markets and it will likely come after the 2nm and 1.8nm nodes, which means you can expect at least the next five years or maybe even longer. Can expect to fall.

Moving on to more interesting news, prominent analyst Dan Nested has managed to dig up documents from TSMC, which reveal information about the firm's 1.4nm process, as disclosed in its annual report to investors. has been disclosed. TSMC says their 1.4nm node is aimed at high-end SoCs and HPC applications, possibly indicating that their primary focus is actually shifting from the traditional mobile and computing markets to the AI ​​segment. Splitting up. TSMC says they will likely explore next-generation EUV scanners for the A14 process, which means it's still in the R&D stages.

TSMC 2nm trial production run

Additionally, the Taiwanese giant says that they have moved into “research studies” for nodes beyond the 14A, which is currently just speculation. Still, they're likely talking about 1nm and beyond if process shrink becomes the way forward in a decade or so. TSMC is expected to increase its R&D spending significantly in the coming years after already seeing an 11.7% annual increase in its R&D budget, and the firm says it will only “14-angstrom, high for 2- Due to surface research activities in nanometer, and 3-nanometer process technologies”.

Well, it was for the firm's Angstrom-14 (1.4nm). The company is expected to reveal more details about it at the TSMC 2024 Technology Symposium, which starts today and runs through Friday, June 28, 2024. TSMC expects to grow rapidly in the future, predicting a high single-digit CAGR over the next five. Sal is the primary catalyst for AI hype, followed by huge demand from markets.

TSMC expects… demand for products such as smartphones and PCs to gradually recover, which has led to somewhat milder growth after consecutive declines over the past two years. In addition, the pace of adoption related to AI will also increase the demand for semiconductors.

– TSMC by Dan Nystedt

Detailing the firm's packaging efforts, TSMC says its CoWoS-S and CoWoS-L are ready for mass production, expected to be the HBM3E memory type used in next-generation AI accelerators. will be used together. Additionally, process upgrades are also in the works and will likely target HBM4 in the future, but details have not yet been revealed.

It's amazing to see the progress on TSMC's 1.4nm process because it shows that the industry is by no means behind, and we're all set to witness a technological miracle hit the markets, but it's still a long way off. . However, with the annual report published by the Taiwanese giant, it seems that they are all set for the future, likely to continue to rule the semiconductor markets. TSMC will compete with Intel in the race for the angstrom era of semiconductors, with the blue team already announcing several nodes in their stacks up to 14A that we talked about here..

News Source: TSMC

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