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SK Hynix partners with TSMC to develop next-gen HBM4 chips, which are critical for AI and slated for mass production in 2026, and advanced chip packaging tech (Nikkei Asia)

SK Hynix partners with TSMC to develop next-gen HBM4 chips, which are critical for AI and slated for mass production in 2026, and advanced chip packaging tech (Nikkei Asia)


Nicky Asia:

SK Hynix partners with TSMC to develop next-generation HBM4 chips, critical to AI and set for mass production in 2026, and advanced chip packaging tech– Asian chipmakers aim to supply next-generation high-bandwidth memory for Nvidia — SEOUL/TAIPEI — SK Hynix.

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