SK hynix and TSMC announced earlier Friday that they have signed a memorandum of understanding to collaborate on developing next-generation HBM4 memory and advanced packaging technology. The move is designed to accelerate the adoption of HBM4 memory and consolidate SK hynix and TSMC's leading positions in high-bandwidth memory and advanced processor applications.

The main focus of SK hynix's and TSMC's initial efforts will be to increase the performance of the HBM4 stack's base die, which (if we put it very simply) acts as an ultrawide interface between memory devices and host processors. With the HBM4, SK hynix plans to use one of TSMC's advanced logic process technologies to create base dies to package additional features and I/O pins within the confines of existing spatial constraints.

This collaborative approach enables SK hynix to customize HBM solutions to meet different customer performance and energy saving needs. HBM has been looking into custom HBM solutions for some time, and teaming up with TSMC will undoubtedly help.

“TSMC and SK hynix have already established a strong partnership over the years. We have worked together to deliver world-leading AI solutions integrating state-of-the-art logic and state-of-the-art HBM,“said Dr. Kevin Zhang, TSMC's Senior Vice President of Business Development and Overseas Operations Office, and Deputy Co-Chief Operating Officer.”Looking ahead to the next-generation HBM4, we are confident that we will continue to work together to deliver the best integrated solutions to unlock new AI innovations for our common customers.“

Additionally, this collaboration extends to improving the integration of SK hynix's HBM with TSMC's CoWoS advanced packaging technology. CoWoS is one of the most popular specialized 2.5D packaging process technologies for integrating logic chips and stacked HBM into a unified module.

For now, it is expected that HBM4 memory will be integrated with logical processors using direct bonding. However, some TSMC customers may prefer to use a more advanced version of CoWoS to integrate HBM4 with their processors.

“We look forward to a strong partnership with TSMC that will help accelerate our efforts to open collaboration with our customers and develop the industry's best-performing HBM4,” said Justin Kim, president and head of AI Infra at SK Hanks.With this collaboration, we will further strengthen our market leadership as a total AI memory provider to compete in the custom memory platform space.“